A report from earlier this week in Sina indicates that the Bank of China has issued Yuan 20 billion (USD $ 2.8 billion) in “special finance bonds” for small and micro firms. For the issuance, the Bank of China used a “self-developed blockchain bond issuance… Read More
Insurtech Platform Shuidi Completes RMB 1 billion C Round of Financing led by Boyu Capital On June 12th, China’s leading Insurtech platform Shuidi (meaning waterdrop in English) was reported to secure RMB 1 billion in C round of financing. The investment was led by Boyu… Read More
Beijing publishes Fintech Development Plan (2018-2022) Recently, the Zhongguancun Administration Committee, the Beijing Financial Work Bureau and the Beijing Municipal Science and Technology Committee jointly issued the “Promotion of Financial Technology Development Plan (2018-2022)” (hereinafter referred to as “plan”). The goal of the plan is,… Read More
Ant Financial and Bank of China Collaborate on Blockchain-based House Leasing Project in Xiong’an New Area On April 20th, Ant’s Xiong’an Digital Technology Co., Ltd. and the Xiong’an branch of Bank of China, signed a strategic cooperation agreement in Xiong’an New Area. In the future,… Read More
Online Marketplace Lenders Banned from Lending to College Students in China On September 6th, Zhao Jianjun, deputy director of the Department of Finance at Ministry of Education, announced at a press conference that online marketplace lenders are banned from lending to college students in China…. Read More
Bank of China and China Construction Bank to Offer Student Loans to University Students Since China Banking Regulatory Commission released regulations on P2P online lending market last month, the student loan market has stagnated. On May 17, Bank of China and China Construction Bank announced… Read More
Crowdfund Insider is the leading news and information web site covering the emerging global industry of disruptive finance including investment crowdfunding, Blockchain peer-to-peer / marketplace lending and other forms of Fintech.